This Autodesk class will introduce you to the latest hardware technology, including how to tune your systems for optimal performance and how to choose the right workstation for your workflow. You’ll learn about the latest CPUs, graphics cards, memory, and storage technologies, as well as the latest updates from AMD, Intel, and Samsung. Here are five new features to look out for in a computer:
AMD’s RDNA 2-based graphics cards
AMD’s new roadmap for RDNA 2-based graphics cards includes improvements to performance per watt. These improvements come from the company’s 7nm process node, which increases transistor efficiency and shrinks overall size. This will help AMD cram more performance into a smaller package. But is the RDNA 2-based GPU really better than its NVIDIA counterparts? Let’s find out! Let’s begin by examining the RX 6800 XT, an AMD graphics card that dominates its Nvidia counterpart at 4K resolution.
Although the RX 6500 XT received mixed reviews, it could well be the first RDNA 2-based graphics card. It is expected to cost $130. AMD has said that the RDNA 2 version of the RX 6500 will have the same features as the non-XT model, but with an additional 512MB of memory. However, the RX 6500 XT’s price remains unknown at this time.
The RDNA 2 architecture is also shown in detail, and features dedicated hardware for ray tracing. The Infinity Cache is also another feature of the new architecture, enabling access to massive amounts of data with speed and efficiency. These improvements will help boost overall GPU performance. AMD says the new architecture will save up to 30 percent of power compared to the RDNA 2 GPUs. The company also plans to offer a software framework to help developers optimize their games.
3D NAND memory
The benefits of using 3D NAND memory are numerous. For starters, it reduces power consumption, lowers costs, and offers faster speed. It is also more durable, so it is more energy-efficient, reducing the overall cost of storage per gigabyte. While 3D NAND is a relatively new technology, specialist manufacturers are pushing the envelope to bring this technology to market. Even though it is still at the lower end of the price, endurance, and performance spectrum, it’s worth considering for high data growth.
As it continues to become more common in industrial sectors, 3D NAND memory is gaining traction. While some engineers are already making the switch, some will remain loyal to the traditional SLC and MLC, which still offer unique customisation attributes. Regardless of the advantages of 3D NAND, it remains to be seen how this technology can benefit industrial sectors and consumers alike. These developments are just the tip of the iceberg.
The process used to manufacture 3D NAND is more complicated than previously thought. Its architecture resembles a vertical skyscraper with multiple layers connected by tiny vertical channels. Current leading-edge devices have 32 or 48 layers, and scaling to 64 layers poses major challenges. However, some manufacturers are targeting 112 layers in the near future. However, until this is done, 3D NAND is expected to remain the future of flash memory.
Intel’s CPU and GPU products
In 2008, Intel launched the Atom. It was intended to power mobile internet devices, such as netbooks. This new CPU offered a 45 nm single-chip design with a thermal design power of only 0.65 watts. It became an instant hit, and Intel sold more than one billion of them. However, it struggled in the 32-bit department, and was widely criticized by critics. The company has since produced several generations of processors with progressively better performance and more power efficiency.
The company was criticized by the European Commission for its anti-competitive practices, which included compensating manufacturers and retailers who preferred its chips. Intel also paid these manufacturers to cancel their AMD products. The fine forced Intel to restructure its business, and the company has now split its products into two divisions: CPUs and graphical components. The company’s CEO, Dr. Lisa Su, took over in 2014, and has remained in that position ever since.
Since Intel’s earliest CPUs have been based on Alder Lake, it is likely that the company will release 13th-generation CPUs based on Raptor Lake. The new chip may be a better version of Alder Lake, but Intel hasn’t specified any architectural improvements. As a result, it won’t be a radical upgrade in the way AMD’s Ryzen 7000 did, and will probably remain similar in performance.
Intel’s nonvolatile memory
Currently, the fastest storage class memory is NAND. But nonvolatile memory has much better performance. Its speed can reach up to 1,000 times that of NAND. That means more data can be stored in a smaller space. But how does this new technology differ from the rest of the nonvolatile memory world? Here are some of the key differences. Its smallest cell size is only a fraction of the size of NAND.
During Micron’s July 2015 unveiling, Mr. Durcan looked uneasy. He hasn’t been able to take advantage of his company’s market position to dictate driver development. That’s why Micron’s nonvolatile memory offerings have lagged behind Intel’s in both hardware and software. In response to Micron’s slowness, Intel has pushed hard to make its controller hardware and software catch up.
Among the latest advances in nonvolatile memory are 3D XPoint (pronounced three dee-cross-point) storage. This new memory technology, jointly developed by Intel and Micron, offers unprecedented performance and durability compared to NAND. As a result, it enables data-intensive applications to run more quickly. The technology also enables new kinds of applications, such as AI and deep learning.
3D XPoint is the latest technology for nonvolatile memory. The semiconductor nonvolatile memory is a key component of many modern computers. It’s the latest nonvolatile memory technology that will revolutionize the way the world uses its electronics. The ability to store more data with 3D XPoint is only one of its many benefits. But the most exciting part is that it’s much cheaper than DRAM.
AMD’s MxGPU technology
AMD’s Multiuser GPU technology is designed to virtualize up to 16 users on a single GPU. It will enable workstation-quality graphics to be made available on smaller devices. It provides innovative data security by isolating virtual members and restricting access to video memory on the hardware level. The benefits of MxGPU will be evident as more people begin to use virtual machines in their day-to-day life.
The Radeon Pro V340, based on the Vega architecture, is an incredibly high-performance dual GPU solution. Unlike 7nm Vega, it uses AMD’s MxGPU technology. The technology enables a single physical GPU to run up to 16 virtual users, while dual Vega GPUs can support up to 32 concurrent virtual users. The AMD Radeon Pro V340 also sports 32GB of HBM2 ECC memory, making it ideal for demanding workloads.
Despite being widely anticipated, the AMD FirePro S7150 is unlikely to be available in the first half of 2016. The company did not mention recommended prices, but it is likely that the new chip will be priced substantially higher than the W7100 x2 (as AMD FirePro-branded products).
Apple’s new hardware
In recent weeks, Apple has been introducing new hardware, a number of which have the same processing power as Intel processors. These new processors are known as Neural Engines. The company claims that these chips process 15.8 trillion operations per second, 40 percent faster than the M1. The Neural Engine also includes a high-bandwidth video decoder that supports 8K video and HEVC. ProRes video engine is capable of recording multiple streams of 4K video. The Secure Enclave ensures best-in-class security and a new image signal processor delivers improved image noise reduction.
Another new chip being developed by Apple is called M2, and is 18% faster than the predecessor. Apple is also investing in head-worn devices, which will have to strike a balance between performance and power. The updated products are expected to be available this fall. For now, Apple has announced several new features for iPad. One new productivity app called Free Form will allow users to collaborate on ideas via video meetings on Facetime. Another new feature is the ability to show groups of apps on a secondary screen. This means that iPad users will be able to work on multiple applications at once.
The next generation of iPhones will also feature Apple’s own silicon. The new M1 family of chips is the most powerful Apple has ever produced, and the new M2 processor is built using the same process. Apple plans to use this chip in its MacBook Air and 13-inch MacBook Pro. The new chip will have 25% more transistors and 50 times the bandwidth. In addition, it will be more efficient. This chip will also have more storage space than the M1.